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The SCC-200 is a fully automated system designed to singulate, clean, and cassette up to 400 wire-sawn wafers within 45 minutes.
The Manual Clean and Detach System is a programmable sink station with adjustable process timers and soak temperatures for rinsing and ultrasonically cleaning sawn wafer combs.
The ATI Wire Saw Tender is a manually manuvered machine that features a powered vertical lift to position a dove-tailed ingot beam into position for transfer to/from an HCT Wire Saw.
Select the links below for more information.
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