SCC 200

The SCC-200 is a fully automated system designed to provide cost-effective post wire saw wafer processing. A single SCC-200 station can singulate, clean, and cassette up to 400 wire-sawn wafers within 45 minutes.

The manipulator loads a wire-sawn ingot into the process chamber for demounting. An automated wet process detaches the wafers to ensure there is no damage to the wafer edge.
After detachment, “No Edge Contact” techniques are used during the wafer handling, cleaning, and cassetting operations. The rotating 16-cassette carousel enables unloading of full cassettes while other wafers are still being processed.

The robust design requires very low maintenance and the ergonomic touch screen is simple to use. Operators are free to perform other tasks once the SCC-200 has been engaged.