For more information on these products, click on the links below.

Vacuum Sealing Systems: Low cost of ownership. Available in variety of models. Custom designs available.
BT-200 Box Taping Machine: Robust clean-room design. Excellent tape adhesion. Tape overlap with a pull-tab. Reduces repetitive motion for operators. Short cycle time.
Wafer Demounting Systems: Low cost of ownership. Consistent wafer handling eliminates operator caused defects. Edge quality is not compromised during detachment. Three process steps in one automated process station.
SCC 200: Eliminates operator-induced defects and breakage. Low cost of ownership. Edge quality is not compromised during detachment. Three process steps in one automated process station. Small 61” x 142” footprint.

Contact us for more information on the products below.

BBS Pads: Material: Felt with adhesive backing. Available in the following shapes: -Rectangle. -Trapezoid.
Notch Polish Pads: Each pad is dressed on equipment designed specifically for the notch polishing pads. Each polishing pad order is inspected by our quality control department and double bagged before shipping.
Vacuum Chucks: Wafer holding. Available in custom sizes. Stainless Steel, Plastics, Aluminum, and Ceramic Coated.