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Wafer Packaging Systems

BT-150 / BT-200
(Box Taping Machine)

Automation Technology’s new taping machines, models BT-150 and BT-200, meet Class 100 clean-room requirements of preparing semiconductor wafer shipping boxes.

These time saving machines automatically apply clean-room sealing tape around the perimeter of any standard 6” or 8” semiconductor wafer shipping box and they provide a more consistent tape application from box to box, while substantially reducing the repetitive motion of hand taping.

An operator simply places the box into the machine’s box receptacle and presses the start button. The machine automatically engages a taping head and rotates the box while it applies the tape around the entire parting line. In addition to rotating the box one and quarter turns to provide a generous tape overlap, the machine also automatically creates a “pull-tab” by doubling the tape against itself for ¾”, just before the tape is automatically cut off. The tab makes tape removal an easy procedure for the end user.

A compliant pressure roller is used to guarantee excellent tape adhesion on uneven box sides while the self-tracking design provides correct and consistent alignment of the tape onto the box. Cycle time per box is less than ten seconds.

The machine incorporates a “box present” sensor as well as a “low tape” sensor. The machine’s control panel provides a visual indicator to the operator before a new roll of tape is required. An operator wearing clean-room gloves can easily change out the tape roll in less than 30 seconds.

Both the 6” model BT-150 and the 8” model BT-200, can be adapted for any brand of shipping box and can accept all brands of clean-room sealing tape.

Features:

  • Robust clean-room design.
  • Consistent taping.
  • Excellent tape adhesion.
  • Tape overlap with a pull-tab.
  • Reduces repetitive motion for operators.
  • Short cycle time.

Specifications:

  • Footprint: 32” wide X 34” deep.
  • Load height: 39”.
  • Utilities: 110 VAC, 15 FLA,
    Single phase.